Co-Packaged Optics: The Interconnect Backbone for AI Data Centers

Data centers are experiencing a massive increase in data traffic due to large language models. However, the connections between graphics processing units (GPUs) have become a critical bottleneck that threatens AI growth. Co-Packaged Optics (CPO) technology offers a promising solution by integrating optical engines directly with ASIC units. The roadmap for electronics and photonics integration consists of three phases. The first phase involves plugable optical modules that consume 30 watts, while the second phase, Near-Package Optics (NPO), reduces consumption to 9 watts.