Chinese AI Chip Makers Turn to 3D Stacking to Break Through Process Bottlenecks

Chinese AI chip companies are increasingly adopting 3D stacking technology as a strategic alternative to advanced process node upgrades due to US export restrictions. Traditional packaging solutions like TSMC's CoWoS face fundamental limitations, prompting a shift towards innovative solutions. Tsingway is developing next-gen AI chips using 3.5D heterogeneous stacking, enhancing data throughput and compute density. Suanmiao Technology has launched its A4E TokenPU chip, achieving 16TB/s memory bandwidth, while Lingchuan Technology focuses on fully domestic 3D stacking technology.