Glass Core Substrates Are Booming: How Far Are They From True Commercialization in Chip Packaging?

Glass core substrates are emerging as a hot topic in semiconductor packaging, driven by the demand for higher performance in AI chips. Major companies like Intel and Samsung are heavily investing in R&D, with BOE Technology Group planning to produce glass substrates for advanced chip packaging. These substrates offer superior dimensional stability and better electrical performance, making them attractive for large-scale AI chip packaging. However, challenges remain, including managing the brittle nature of glass and developing reliable processes for through-glass via formation.